发明名称 |
Adhesive reinforced open hole interconnect |
摘要 |
A method for interconnecting a first flex printed circuit board (PCB) with a second flex PCB. The method includes: providing the first flex PCB with holes at contact locations to be electrically coupled to the second flex PCB; providing the second flex PCB with electrical pads corresponding to the holes at the contact locations; applying a non-conductive material between the first PCB and the and second PCB with clearances for each of the electrical pads; aligning the first PCB with the second PCB so that the holes in the first PCB are in line with the corresponding electrical pads on the second PCB; bonding a portion of flat areas on the first and second PCBs together; dispensing a conductive adhesive into the holes to fill the space created by the holes, corresponding clearances of the non-conductive material, and the corresponding electrical pads; and curing the conductive adhesive.
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申请公布号 |
US8354595(B2) |
申请公布日期 |
2013.01.15 |
申请号 |
US20100764854 |
申请日期 |
2010.04.21 |
申请人 |
RAYTHEON COMPANY;ROLSTON KEVIN C.;VISCARRA ALBERTO F.;PRUDEN DEREK;MA CINDY W. |
发明人 |
ROLSTON KEVIN C.;VISCARRA ALBERTO F.;PRUDEN DEREK;MA CINDY W. |
分类号 |
H05K1/00 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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