摘要 |
The invention relates to a device for curing a plastic material, in particular a sealing compound and/or a filling compound for tolerance adjustment or gap filling, respectively, wherein the plastic material is at least partly inserted in a gap area between two components, and wherein at least one of the components is made of a fiber reinforced plastic material, in particular of a carbon fiber reinforced epoxy resin. According to the invention the device is provided with at least one electromagnetic inductor for a locally defined heating of the gap area and for curing the plastic material arranged in the gap area. Due to the electromagnetic inductor which might be a linear inductor or a circular inductor a contact-less and fast curing of the plastic material is possible.
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