发明名称 Semiconductor device and method of manufacturing the same
摘要 A body contact layer 18 is formed on the side of a recessed structure 17 as well as in the bottom of the recessed structure 17, so that a contact area between the body contact layer 18 and a well layer 12 is increased and the amount of dopant implanted to the body contact layer 18 is suppressed.
申请公布号 US8354712(B2) 申请公布日期 2013.01.15
申请号 US201113023889 申请日期 2011.02.09
申请人 PANASONIC CORPORATION;HAMADA MITSUHIRO;JOKYU KATSUYOSHI 发明人 HAMADA MITSUHIRO;JOKYU KATSUYOSHI
分类号 H01L27/108;H01L29/76 主分类号 H01L27/108
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