发明名称 |
Laminated electronic component |
摘要 |
A laminated electronic component includes a component body including a plurality of laminated functional layers, a plurality of internal conductors provided inside the component body, and an external terminal electrode that is electrically connected to an internal conductor via an exposed portion of the internal conductor and that is defined by a direct plating film. An average grain diameter of metal grains defining the plating film is about 0.1 μm or less.
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申请公布号 |
US8355241(B2) |
申请公布日期 |
2013.01.15 |
申请号 |
US20100943072 |
申请日期 |
2010.11.10 |
申请人 |
MURATA MANUFACTURING CO., LTD.;OGAWA MAKOTO;MOTOKI AKIHIRO;TAKEUCHI SYUNSUKE;KAWASAKI KENICHI |
发明人 |
OGAWA MAKOTO;MOTOKI AKIHIRO;TAKEUCHI SYUNSUKE;KAWASAKI KENICHI |
分类号 |
H01G4/228;H01G4/06 |
主分类号 |
H01G4/228 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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