发明名称 Laminated electronic component
摘要 A laminated electronic component includes a component body including a plurality of laminated functional layers, a plurality of internal conductors provided inside the component body, and an external terminal electrode that is electrically connected to an internal conductor via an exposed portion of the internal conductor and that is defined by a direct plating film. An average grain diameter of metal grains defining the plating film is about 0.1 μm or less.
申请公布号 US8355241(B2) 申请公布日期 2013.01.15
申请号 US20100943072 申请日期 2010.11.10
申请人 MURATA MANUFACTURING CO., LTD.;OGAWA MAKOTO;MOTOKI AKIHIRO;TAKEUCHI SYUNSUKE;KAWASAKI KENICHI 发明人 OGAWA MAKOTO;MOTOKI AKIHIRO;TAKEUCHI SYUNSUKE;KAWASAKI KENICHI
分类号 H01G4/228;H01G4/06 主分类号 H01G4/228
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