发明名称 |
Semiconductor chips having guard rings and methods of fabricating the same |
摘要 |
Provided is a semiconductor chip. The semiconductor chip includes a semiconductor substrate including a main chip region and a scribe lane region surrounding the main chip region. An insulating layer is disposed over the semiconductor substrate. A guard ring is disposed in the insulating layer in the scribe lane region. The guard ring surrounds at least a portion of the main chip region. The guard ring has a brittleness greater than a brittleness of the insulating layer.
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申请公布号 |
US8354735(B2) |
申请公布日期 |
2013.01.15 |
申请号 |
US20100875382 |
申请日期 |
2010.09.03 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD.;LEE JUNG-DO;KIM JONGKOOK;LEE SEOK WON;LEE JAESIK;IM HOHYEUK;PARK SU-MIN |
发明人 |
LEE JUNG-DO;KIM JONGKOOK;LEE SEOK WON;LEE JAESIK;IM HOHYEUK;PARK SU-MIN |
分类号 |
H01L23/544 |
主分类号 |
H01L23/544 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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