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发明名称
Stress buffer structures in a mounting structure of a semiconductor device
摘要
A mounting structure for a semiconductor device includes a stepwise stress buffer layer under a likewise stepwise UBM structure.
申请公布号
US8354750(B2)
申请公布日期
2013.01.15
申请号
US20100697473
申请日期
2010.02.01
申请人
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.;WANG TZU-YU;CHIU TZU-WEI;JENG SHIN-PUU
发明人
WANG TZU-YU;CHIU TZU-WEI;JENG SHIN-PUU
分类号
H01L23/498
主分类号
H01L23/498
代理机构
代理人
主权项
地址
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