PROCESS FOR MANUFACTURING SEMICONDUCTOR STRUCTURE USING TEMPORARY BONDING

摘要

PROBLEM TO BE SOLVED: To provide a process for manufacturing a semiconductor structure.

SOLUTION: A process for manufacturing the semiconductor structure includes the following steps of: a step (E1) of providing handling substrates (1 and 2) including a seed substrate (1) and a sacrifice layer (2) which covers the seed substrate (1) and is weakened; a step (E2) of joining the handling substrates (1 and 2) and a carrier substrate (3) to each other; a step (E3) of optionally processing the carrier substrate (3); a step (E4) of separating the handling substrates in the sacrifice layer (2), and forming a semiconductor structure; and a step (E5) of removing a residue of the sacrifice layer (2) existing on the seed substrate (1) when the residue exists.

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