| 摘要 |
<P>PROBLEM TO BE SOLVED: To perform cutting, cleaning and laser processing without conveying a workpiece according to a complex procedure. <P>SOLUTION: The cutting device 1 comprises: cutting means 6 for cutting a workpiece held on a rotatable chuck table 3 by bringing a cutting blade 61b into contact with the workpiece while rotating; cleaning means 5 including a nozzle 51 for jetting a cleaning fluid to the workpiece held on the chuck table 3; and a laser processing means 4 for performing laser processing of the workpiece held on the chuck table 3. The operating positions of the cutting means 6, the cleaning means 5 and the laser processing means 4 are located on the same drive shaft 70 so that the workpiece held on the same chuck table 3 can be operated continuously by the cutting means 6, the cleaning means 5 and the laser processing means 4, thus reducing damage on the workpiece during conveyance. <P>COPYRIGHT: (C)2013,JPO&INPIT |
