| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive member that can be sufficiently injected into even space formed between wafers when the wafers having large area are stuck to each other, and is not cured in a process of injection. <P>SOLUTION: A semiconductor device comprises: an adhesion substrate and an adhesion object substrate having a connection region; a connection member arranged between the respective connection regions of the adhesion substrate and the adhesion object substrate; and an adhesive member surrounding the connection members and sticking the adhesion substrate to the adhesion object substrate. In the semiconductor device, the adhesive member contains: a main agent having a functional group; and a curing agent expressing an activation function of the functional group by provision of energy, and is a resin cured by binding the functional group activated by the curing agent to another functional group. <P>COPYRIGHT: (C)2013,JPO&INPIT |
