发明名称 MOLDING MATERIAL
摘要 <P>PROBLEM TO BE SOLVED: To provide a molding material that facilitates manufacturing a molded article having high heat resistance and mechanical characteristics without losing economic potential and productivity in a process for manufacturing the molding material. <P>SOLUTION: The molding material is comprised by bonding a complex comprising 1-50 wt.% of a continuous reinforced fiber bundle (A) and 0.1-30 wt.% of polyphenylene ether etherketone (B) to 20-98.9 wt.% of thermoplastic resin (C). In the polyphenylene ether etherketone, the component (B) is obtained by polymerizing polyphenylene ether etherketone oligomer (B') whose melt point is 270 &deg;C or less with a polymerization catalyst (D). <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013006352(A) 申请公布日期 2013.01.10
申请号 JP20110140690 申请日期 2011.06.24
申请人 TORAY IND INC 发明人 IMAI NAOKICHI;TSUCHIYA ATSUKI;HONMA MASATO;YAMASHITA KOHEI;HORIUCHI SHUNSUKE;YAMAUCHI KOJI
分类号 B29B11/16;B29K101/12;B29K105/08 主分类号 B29B11/16
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