PRINTED CIRCUIT BOARD AND METHOD FOR SELECTING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a printed circuit board that is excellent in insulation reliability between copper wirings.

SOLUTION: A printed circuit board has a substrate with copper wirings that has a substrate and copper wirings disposed on the substrate, and a copper ion diffusion suppression layer that includes a nitrogen-containing organic compound coating the copper wirings. The adhesion amount of the nitrogen-containing organic compound is 5×10-9to 1×10-6g/mm2. The ratio (B/A) of etching rate of the copper wirings when immersed in an etching aqueous solution that includes 1.8 mass% of sulfuric acid and 12 mass% of sodium peroxodisulfate (B μm/min) and that of the copper wirings having no copper ion diffusion suppression layers when immersed in the etching aqueous solution (A μm/min) is less than 1.2.

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