| 摘要 |
An apparatus for interconnecting a first die and a second die of a multi-die device includes a master circuit block that interfaces with the first die of the multi-die device, a slave circuit block that interfaces with the second die of the multi-die device, a first memory in the slave circuit block, a second memory in the master circuit block, and a plurality of μbumps between the first die and the second die, wherein the master circuit block and the slave circuit block are configured to identify one of the μbumps as a faulty μbump, and store a first value that corresponds with the identified faulty μbump in the first memory.
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