| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive film which can be layered onto a wafer back surface at low temperature, exhibits high hot adhesive force, excellently fills substrate surface roughness, and has excellent reflow resistance; and a semiconductor device using the adhesive film. <P>SOLUTION: The adhesive film 1 uses an adhesive composition 2 including: a high molecular weight component (A) having weight-average molecular weight of ≥100,000 and including a functional group; a thermosetting resin component (B) including an epoxy resin (b1) and a phenol resin; a first filler (D) with a BET specific surface area of ≥30 m<SP POS="POST">2</SP>/g; and a second filler (E) with a BET specific surface area of <30 m<SP POS="POST">2</SP>/g. <P>COPYRIGHT: (C)2013,JPO&INPIT |
