发明名称 FUNCTIONAL LIQUID PATTERN FORMATION METHOD, CONDUCTIVE PATTERN FORMATION METHOD, FUNCTIONAL LIQUID PATTERN FORMATION SYSTEM, CONDUCTIVE PATTERN FORMATION SYSTEM, METHOD FOR MANUFACTURING FUNCTIONAL LIQUID PATTERN STRUCTURE AND METHOD FOR MANUFACTURING CONDUCTIVE PATTERN STRUCTURE
摘要 <P>PROBLEM TO BE SOLVED: To provide a functional liquid pattern formation method/system and a conductive pattern formation method/system, along with a method for manufacturing a functional liquid pattern structure and a method for manufacturing a conductive pattern structure, capable of avoiding occurrence of a bulge, a jaggy and the like and preferably forming a fine pattern. <P>SOLUTION: A base material is heated and maintained at a surface temperature of 45&deg;C or more (preferably 60&deg;C or more). A pattern of a catalyst carrying polymer liquid for plating is formed by discharging the catalyst carrying polymer liquid for plating containing a catalyst carrying polymer for plating, a high boiling point solvent and a low boiling point solvent on the base material by an ink jet system, on the basis of the discharge condition that a diameter D1 of a discharge liquid drop, a pitch W between dots of the catalyst carrying polymer liquid for plating and a diameter D2 of the dot of the liquid satisfy the relation of D<SB POS="POST">1</SB><W<D<SB POS="POST">2</SB>. A conductive pattern consisting of a plating film is formed by adding a plating catalyst (or plating catalyst precursor) after curing the liquid and performing plating treatment. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013008851(A) 申请公布日期 2013.01.10
申请号 JP20110140729 申请日期 2011.06.24
申请人 FUJIFILM CORP 发明人 KATSUMURA MANABU
分类号 H05K3/38;H05K3/10;H05K3/18 主分类号 H05K3/38
代理机构 代理人
主权项
地址