| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent damage on the surface of a semiconductor chip which is caused by a filler contained in a mold resin of a chip lamination mold sealing type semiconductor device. <P>SOLUTION: The method of manufacturing a semiconductor device of a present embodiment includes a step (a) in which a second semiconductor chip 3 is stacked and bonded on a first semiconductor chip 2 through an adhesive layer 5, a step (b) for adjusting at least one of the elasticity of the adhesive layer, its shrinkage, thickness of a protective film, and its elasticity [MPa] so that a value y of the following formula (1) comes to be 70 or less, and a step (c) in which, after the step (b), the first and second semiconductor chips are sealed with a mold resin 10 containing filler 10a. Here, y=74.7-82.7a1+273.2a2-9882a3+65.8a4...(1) (where a1 is a log of elasticity [MPa] of the adhesive layer, a2 is shrinkage amount [mm] of the adhesive layer, a3 is thickness [mm] of the protective film on the surface of first semiconductor chip, and a4 is a log of elasticity [MPa] of the protective film on the surface of the first semiconductor chip.) <P>COPYRIGHT: (C)2013,JPO&INPIT |
