发明名称 |
SEMICONDUCTOR ELEMENT-EMBEDDED SUBSTRATE, AND METHOD OF MANUFACTURING THE SUBSTRATE |
摘要 |
A semiconductor element-embedded substrate includes a semiconductor element; a chip component; a peripheral insulating layer covering at least the outer circumferential side surfaces thereof; an upper surface-side wiring line provided on the upper surface side of the substrate; and a lower surface-side wiring line provided on the lower surface side of the substrate. The built-in semiconductor element includes a terminal on the upper surface side thereof, and this terminal is electrically connected to the upper surface-side wiring line. The built-in chip component includes an upper surface-side terminal electrically connected to the upper surface-side wiring line; a lower surface-side terminal electrically connected to the lower surface-side wiring line; and a through-chip via penetrating through the chip component to connect the upper surface-side terminal and the lower surface-side terminal.
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申请公布号 |
US2013009325(A1) |
申请公布日期 |
2013.01.10 |
申请号 |
US201113635621 |
申请日期 |
2011.01.25 |
申请人 |
NEC CORPORATION;MORI KENTARO;YAMAMICHI SHINTARO;MURAI HIDEYA;KIKUCHI KATSUMI;NAKASHIMA YOSHIKI;OHSHIMA DAISUKE |
发明人 |
MORI KENTARO;YAMAMICHI SHINTARO;MURAI HIDEYA;KIKUCHI KATSUMI;NAKASHIMA YOSHIKI;OHSHIMA DAISUKE |
分类号 |
H01L23/48;H01L21/56;H01L21/768 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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