| 摘要 |
<p>Provided is a laser cutting device (1) that prevents adverse effects to a cutting surface due to self-burning caused by excess oxygen, reduces an oxygen gas that does not contribute to cutting, irradiates a laser beam (3a) to a cutting target material (2) so as to maintain processing precision, and performs cutting while the oxygen gas is emitted to a cut point (2a) irradiated with the laser beam (3a) and to the vicinity of the cut point (2a), the device having a plurality of nozzle tips (5) that is provided around a nozzle tip (4) for emitting the laser beam (3a), a control portion that determines the nozzle tips (5) placed back and forth in a cutting progression direction behind the cutting point (2a) among the plurality of nozzle tips (5), and a gas supplying portion (8) that supplies an oxygen gas of high pressure to the nozzle tips (5) placed back and forth in the cutting progression direction behind the cutting point (2a) determined by the control portion (6), and supplies an oxygen gas of low pressure to the nozzle tips (5) placed in parts except for the front and back in the cutting progression direction.</p> |
