| 摘要 |
<P>PROBLEM TO BE SOLVED: To increase the bonding strength of a coating film to a circuit component for suppressing the occurrence of separation between layers and a crack in a package. <P>SOLUTION: A method for manufacturing a package into which a circuit component (20) is integrally sealed with a mold resin (40) comprises: a coating step where at least one part of the surface of the circuit component (20) opposed to the mold resin (40) is covered with a coating film (30) for suppressing the separation from the mold resin (40); and a molding step where the mold resin (40) is shaped, whereby the circuit component (20) covered with the coating film (30) is integrally sealed. In the coating step, a coating material (31) for forming the coating film (30) is exposed to plasma (33) and brought into its active condition before deposition on the surface of the circuit component (20), and then deposited on the surface of the circuit component (20) in an active condition. <P>COPYRIGHT: (C)2013,JPO&INPIT |
