| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a circuit board which ensures prevention of the formation failure of a solder fillet during flow soldering and is suitable for packaging performed by an automatic packaging machine. <P>SOLUTION: A circuit board of this invention comprises: a printed wiring board 2 having lead terminal insertion holes 5; an electronic component 1 having lead terminals 4 inserted into the lead terminal insertion holes 5 and mounted on the printed wiring board 2; and a jumper lead wire member 3 installed so as to be sandwiched between a bottom surface of the electronic component 1 and the print wiring board 2. A clearance is formed between the bottom surface of the electronic component 1 and the print wiring board 2 by the jumper lead wire member 3. <P>COPYRIGHT: (C)2013,JPO&INPIT |
