| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a printed board with a new structure, which can suppress surplus solder between land portions adjacent to each other by a simple structure to prevent failure, such as solder bridges, when lead portions of a mounted component are soldered to the aligned land portions by drag soldering. <P>SOLUTION: In a printed board 10, land portions 14 having through holes 12 into which lead portions 20 of mounted components 16a and 16b are inserted are aligned, and the land portions 14 and the lead portions 20 are soldered to each other by drag soldering. Extension land portions 30a and 30b extending to a direction orthogonal to the aligning direction of the land portions 14 are installed continuing to the land portions 14. <P>COPYRIGHT: (C)2013,JPO&INPIT |
