| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive for connecting circuit members, which cures at a low temperature in a short time, can obtain a connecting structure of the circuit members with excellent adhesive strength even when circuit members are connected, can adequately suppress deterioration in the connection reliability of the resulting connecting structure in a high temperature and high humidity environment, and is further excellent in handleability; and to provide a connecting structure of circuit members using the adhesive. <P>SOLUTION: The adhesive contains a thermoplastic resin (a), a radical polymerizable compound (b) which is in a solid-state at ≤30°C, and a radical polymerization initiator (c), wherein: the radical polymerizable compound (b) contains epoxy acrylate; and the content of radical polymerizable compound (b) is 5 to 33.3 pts.mass based on 100 pts.mass of the thermoplastic resin (a). <P>COPYRIGHT: (C)2013,JPO&INPIT |
