| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board for wafer inspection capable of excellently discharging binder decomposition gas to the outside of a substrate and stably supplying electricity to conductor wires arranged on the surface of the substrate. <P>SOLUTION: The wiring board includes: a laminate 5 including an upper surface and a lower surface having a center area 5a and a peripheral edge area 5b; and a plurality of input/output terminals 9 arranged on the peripheral edge area 5b of the lower surface of the laminate 5. In a plane perspective view, the laminate 5 includes hole parts 19 located on the center area 5a, opened to the lower surface and reaching the midstream of a plurality of ceramic layers 3 and a hollow part 21 located on the inside of the laminate so as to be superposed to the peripheral edge area 5b. <P>COPYRIGHT: (C)2013,JPO&INPIT |
