| 摘要 |
The present invention provides a method for producing an electronic substrate that is provided with highly reliable electronic elements and lines. The method of the present invention provides an electronic substrate which includes a main substrate, a first conductive layer, a first insulating layer, a second conductive layer, a second insulating layer, and a third conductive layer, laminated in the order set forth, and in which the first conductive layer, the second conductive layer, and the third conductive layer are connected together at an opening that penetrates the first insulating layer and the second insulating layer. The manufacturing method includes the steps of: forming the first conductive layer; forming the first insulating layer with an opening which exposes at least a part of the first conductive layer; applying a conductive film to an exposed portion of the first conductive layer and on the first insulating layer; forming the second conductive layer that covers a surface of the exposed portion of the first conductive layer by applying a resist to a part of the conductive film and etching the conductive film that does not overlap the resist; forming the second insulating layer with an opening which exposes at least a part of the second conductive layer; and forming the third conductive layer on an exposed portion of the second conductive layer and on the second insulating layer. |
