EPOXY RESIN COMPOSITION FOR ELECTRONIC COMPONENT ENCAPSULATION AND ELECTRONIC COMPONENT DEVICE USING THE SAME

摘要

The present invention relates to an epoxy resin composition for electronic component encapsulation, including the following components (A) to (D): (A) an epoxy resin; (B) a curing agent: an allylated phenol resin containing a structural unit (1) shown below and a structural unit (2) shown below, in which a molar ratio [structural unit (1)/[structural unit (1)+structural unit (2)]×100] of the structural unit (1) to a total amount of the structural unit (1) and the structural unit (2) is from 40 to 100%; (C) a curing accelerator; and (D) an inorganic filler, in which the allylated phenol resin as the component (B) has a glass transition temperature of −5° C. to 70° C. as measured by a differential scanning calorimetry (DSC) method: