MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SUBSTRATE SHEET WITH CONDUCTIVE BUMPS

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing apparatus and a manufacturing method of a substrate sheet with conductive bumps which reduce the number of processes where a conductive paste is applied to a surface of the substrate sheet and thereby shortening the manufacturing time of the substrate sheet with the conductive bumps.

SOLUTION: A squeegee 36 (36a, 36b, 36c) of a squeegee unit has a shape that gradually narrows toward its tip. A conductive paste, transferred onto a substrate sheet 10 by the squeegee 36, contains 85 to 98% by weight of metal powder.

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