TAPE APPLICATION APPARATUS

摘要

A tape application apparatus (1) is provided with: a rubber sheet (10) that separates an airtight space (5) formed in a chamber (6) into first and second airtight spaces (7 and 8), and holds a wafer (9) on the top surface thereof; a tape frame (12) that holds tape (11) above the rubber sheet (10); and a gas supply/suction mechanism (3) that switches between pressurizing and depressurizing by subjecting the first and second airtight spaces (7 and 8) to gas supply or suctioning. After depressurizing the first and second airtight spaces (7 and 8), the tape application apparatus pressurizes the second airtight space (8), causing the rubber sheet (10) to expand and adhering the wafer (9) to the tape (11), then pressurizes the first airtight space (7), causing the rubber sheet (10) to contract. The gas supply/suction mechanism (3) has a first flow-rate control valve (27) that controls the flow rate of suctioned gas during depressurization of the first airtight space (7), and a second flow-rate control valve (28) that controls the flow rate of supplied gas during pressurization of the first airtight space (7).