METHOD FOR FORMING CONTACT HOLE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

A post is formed on a substrate. After applying an insulating film material over the substrate so as to form a film on the substrate such that the upper end of the post is exposed, the insulating film material is cured, thereby forming an insulating film on the substrate. A contact hole is formed in the insulating film by removing the post. The post has a curved portion or bent portion that protrudes in a direction that is opposite to the flowing direction of the insulating film material that is applied and formed into a film.