| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a processing method of a wafer capable of reducing the risk of wafer breakage, and capable of processing a wafer along a scheduled cut line by detecting the scheduled cut line of the wafer. <P>SOLUTION: The processing method of a wafer includes a positional relationship storage step for storing the positional relationship of an alignment mark and a scheduled cut line as the positional relationship information, an alignment mark position detection step for detecting the position of the alignment mark by capturing the image of a substrate to which a wafer is pasted from the wafer side after the execution of the positional relationship storage step, and a processing step for processing the wafer along the scheduled cut line from the surface side of the wafer pasted to the substrate, on the basis of the position of the alignment mark detected in the alignment mark position detection step and the positional relationship information stored in the positional relationship storage step. <P>COPYRIGHT: (C)2013,JPO&INPIT |
