| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate processing method and a substrate processing apparatus which prevent contamination and the like of a surface of a processed substrate which is caused by an adhesive for bonding the processed substrate to a support substrate. <P>SOLUTION: A substrate processing method according to one embodiment includes the steps of: bonding a processed substrate 10 on a support substrate 14 through an adhesive 12; removing a peripheral part of the processed substrate 10 with the adhesive 12 adhered to the peripheral part; and grinding a surface of the processed substrate 10, where the peripheral part is removed, on the opposite side of the support substrate 14. A substrate processing apparatus according to one embodiment includes: removing means removing the peripheral part of the processed substrate which is bonded to the support substrate through the adhesive with the adhesive adhered to the peripheral part at once; and grinding means grinding the surface of the processed substrate, where the peripheral part is removed, on the opposite side of the support substrate. <P>COPYRIGHT: (C)2013,JPO&INPIT |
