发明名称 WIRING BOARD AND METHOD FOR MANUFACTURING WIRING BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a wiring board capable of satisfying alignment accuracy in alignment in a panel size, even if the wiring board has a large panel size, a thin thickness and a minute remaining width of a land, and capable of improving yield, and a method for manufacturing the wiring board. <P>SOLUTION: A wiring board has a region outside product provided in an end part, and a product region which is provided inside the region outside product and in which a plurality of sheets becoming products are arranged. An alignment guide for aligning the wiring board with a photo mask is formed at a position which is symmetrical to a lateral direction bisector of the wiring board or a position which is symmetrical to a longitudinal direction bisector. Moreover, a method for manufacturing the wiring board is provided. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013008910(A) 申请公布日期 2013.01.10
申请号 JP20110141723 申请日期 2011.06.27
申请人 HITACHI CHEM CO LTD 发明人 YAMAMOTO TEPPEI;ISODA SATOSHI;ISHIHARA MITSUYASU
分类号 H05K1/02;H05K3/00 主分类号 H05K1/02
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