发明名称 |
Semiconductor package and method of manufacturing the same |
摘要 |
There are provided a semiconductor package including an antenna formed integrally therewith, and a method of manufacturing the same. The semiconductor package includes: a semiconductor chip; a sealing part sealing the semiconductor chip; a substrate part formed on at least one surface of the sealing part; and an antenna part formed on the sealing part or the substrate part and electrically connected to the semiconductor chip.
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申请公布号 |
US2013009320(A1) |
申请公布日期 |
2013.01.10 |
申请号 |
US201113200335 |
申请日期 |
2011.09.23 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD.;YOO DO JAE;YOON JUNG HO;PARK CHUL GYUN;HAN MYEONG WOO;LEE JUNG AUN |
发明人 |
YOO DO JAE;YOON JUNG HO;PARK CHUL GYUN;HAN MYEONG WOO;LEE JUNG AUN |
分类号 |
H01L23/48;H01L21/56 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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