发明名称 WIRING BOARD AND MANUFACTURING METHOD OF THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a wiring board which ensures the inductor performance even if the wiring board includes a small number of layers, and to provide a manufacturing method of the wiring board. <P>SOLUTION: A wiring board 10 includes: a base material 20 having a first surface F and a second surface S; first through hole conductors 30A, 30C, 30E and second through hole conductors 30B, 30D, 30F which penetrate through the base material 20; first conductor patterns 33B, 33C formed on the first surface F side of the base material 20 and connecting the first through hole conductors 30A, 30C, 30E with the second through hole conductors 30B, 30D, 30F; and second conductor patterns 34A, 34B, 34C formed on the second surface S side of the base material 20 and connecting the first through hole conductors 30A, 30C, 30E with the second through hole conductors 30B, 30D, 30F. The first through hole conductors, the second through hole conductors, the first conductor patterns, and the second conductor patterns form an inductor L. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013008895(A) 申请公布日期 2013.01.10
申请号 JP20110141523 申请日期 2011.06.27
申请人 IBIDEN CO LTD 发明人 MANO YASUHIKO;KATO SHINOBU;KARIYA TAKASHI
分类号 H05K3/46;H01L23/12 主分类号 H05K3/46
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