发明名称 |
PACKAGING SUBSTRATE AND METHOD OF FABRICATING THE SAME |
摘要 |
A packaging substrate includes a first dielectric layer; a plurality of first conductive pads embedded in and exposed from a first surface of the first dielectric layer; a first circuit layer embedded in and exposed from a second surface of the first dielectric layer; a plurality of first metal bumps disposed in the first dielectric layer, each of the first metal bumps having a first end embedded in the first circuit layer and a second end opposing the first end and disposed on one of the first conductive pads, a conductive seedlayer being disposed between the first circuit layer and the first dielectric layer and between the first circuit layer and the first metal bump; a built-up structure disposed on the first circuit layer and the first dielectric layer; and a plurality of second conductive pads disposed on the built-up structure. The packaging substrate has an over-warpage problem improved.
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申请公布号 |
US2013009293(A1) |
申请公布日期 |
2013.01.10 |
申请号 |
US201213542928 |
申请日期 |
2012.07.06 |
申请人 |
UNIMICRON TECHNOLOGY CORPORATION;TSENG TZYY-JANG;HO CHUNG-W. |
发明人 |
TSENG TZYY-JANG;HO CHUNG-W. |
分类号 |
H01L23/495;H01L21/60 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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