MODULAR CHIP STACK AND PACKAGING TECHNOLOGY WITH VOLTAGE SEGMENTATION, REGULATION, INTEGRATED DECOUPLING CAPACITANCE, AND COOLING STRUCTURE AND PROCESS

摘要

An electronic apparatus includes an electronic component electrically connected to a substrate positioned beneath the electronic component. A member includes a plurality of decoupling capacitors having different voltages, and the decoupling capacitors are electrically connected to the electronic component. A plurality of voltage planes in the member are electrically connected to the decoupling capacitors. The decoupling capacitors, via the voltage planes in the member, provide different voltages to the voltage planes and thus the electronic component.