Method for wave soldering of e.g. printed circuit boards in wave soldering station to connect cooling bodies, involves preheating products for even heat distribution via solder masks, which consist of infrared transparent material portions

摘要

The method involves preheating of products e.g. circuit boards or printed circuit boards (1), with infrared thermal radiation before soldering of the products. The products are preheated for even heat distribution via solder masks (7), which consist of portions made from infrared radiant heat transparent material. The printed circuit boards are preheated with the solder masks at surface sides by infrared thermal radiation, where the surface sides comprise an electro-plating. The solder masks are made from mineral glasses i.e. quartz glasses, and/or glass ceramic. An independent claim is also included for a solder mask.