发明名称 |
BACKSIDE ILLUMINATION SENSOR HAVING A BONDING PAD STRUCTURE AND METHOD OF MAKING THE SAME |
摘要 |
The present disclosure provides one embodiment of a semiconductor structure. The semiconductor structure comprises a device substrate having a front side and a back side; an interconnect structure disposed on the front side of the device substrate; and a bonding pad connected to the interconnect structure. The bonding pad comprises a recessed region in a dielectric material layer; a dielectric mesa of the dielectric material layer interposed between the recessed region; and a metal layer disposed in the recessed region and on the dielectric mesa. |
申请公布号 |
US2013009270(A1) |
申请公布日期 |
2013.01.10 |
申请号 |
US201113177686 |
申请日期 |
2011.07.07 |
申请人 |
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.;TSAI SHUANG-JI;YAUNG DUN-NIAN;LIN JENG-SHYAN;LIU JEN-CHENG;WANG WEN-DE;LIN YUEH-CHIOU |
发明人 |
TSAI SHUANG-JI;YAUNG DUN-NIAN;LIN JENG-SHYAN;LIU JEN-CHENG;WANG WEN-DE;LIN YUEH-CHIOU |
分类号 |
H01L31/0224;H01L23/485;H01L31/18 |
主分类号 |
H01L31/0224 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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