发明名称 POLYMERIC COMPOUND
摘要 <P>PROBLEM TO BE SOLVED: To provide a polymeric compound useful as a resin component to be used in a negative resist composition, from which a resist pattern with a good shape can be formed. <P>SOLUTION: The polymeric compound has a structural unit (f1) including a base dissociative group expressed by general formula (f1-1) or general formula (f1-2) and a structural unit (f2) including a crosslinking group-containing group. In the formulae, R represents a hydrogen atom, a 1-5C lower alkyl group or a 1-5C halogenated lower alkyl group; X represents a divalent organic group; A<SB POS="POST">aryl</SB>represents an aromatic cyclic group optionally having a substituent; X<SB POS="POST">01</SB>represents a single bond or a divalent connecting group; and R<SP POS="POST">2</SP>represents an organic group having a fluorine atom. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013007046(A) 申请公布日期 2013.01.10
申请号 JP20120185462 申请日期 2012.08.24
申请人 TOKYO OHKA KOGYO CO LTD 发明人 ABE SHO;SHIONO HIROHISA;HIRANO TOMOYUKI;DAZAI NAOHIRO
分类号 C08F212/02;C08F220/26;G03F7/004;G03F7/038 主分类号 C08F212/02
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