| 摘要 |
<P>PROBLEM TO BE SOLVED: To assign identification numbers to an arbitral number of chips without increasing the number of through-hole electrodes (TSV) between the chips. <P>SOLUTION: A semiconductor device of the invention is a semiconductor device that includes a plurality of laminated chips. One of the plurality of chips includes a pulse generating unit (1100) that generates a pulse signal based on a predetermined signal and supplies the pulse signal to an adjacent chip. Each of the chips not including the one chip among the plurality of chips includes: a pulse change unit (2200) that is supplied with the pulse signal from one adjacent chip, and changes the number of pulses of the pulse signal and supplies the pulse signal to the other adjacent chip; and an identification signal generating unit (2100) that generates an identification signal representing an identification number of the chip in accordance with the number of pulses of the pulse signal. <P>COPYRIGHT: (C)2013,JPO&INPIT |
