发明名称 |
THERMOSETTING RESIN COMPOSITION, B-STAGE HEAT CONDUCTIVE SHEET, AND POWER MODULE |
摘要 |
Provided is a thermosetting resin composition including an inorganic filler and a thermosetting resin matrix component, in which the inorganic filler includes secondary sintered particles each formed of primary particles of scaly boron nitride, and at least some of the secondary sintered particles each have a maximum cavity diameter of 5 μm to 80 μm. The thermosetting resin composition can be used for providing a heat conductive sheet in which electrical insulation property is kept by controlling where the defects such as voids and cracks occur and their size, and which has excellent heat conductivity.
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申请公布号 |
US2013012621(A1) |
申请公布日期 |
2013.01.10 |
申请号 |
US201013576065 |
申请日期 |
2010.12.28 |
申请人 |
MITSUBISHI ELECTRIC CORPORATION;YAMAMOTO KEI;NISHIMURA TAKASHI;MIMURA KENJI;MASAKI MOTOKI;HIRAMATSU SEIKI;YIN XIAOHONG |
发明人 |
YAMAMOTO KEI;NISHIMURA TAKASHI;MIMURA KENJI;MASAKI MOTOKI;HIRAMATSU SEIKI;YIN XIAOHONG |
分类号 |
C08L63/02;C08K3/38;C08L63/00;C08L67/00;C08L71/10;C08L79/04;C08L79/08;C08L83/00 |
主分类号 |
C08L63/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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