| 摘要 |
A device for thermally treating workpieces, in particular circuit boards or the like that are equipped with electrical and electronic components, comprising at least one process chamber in which at least one heating or cooling zone is formed or disposed, a temperature controlled gaseous fluid being introduced into said heating or cooling zone, wherein the workpieces pass through the heating or cooling zone and heat is transferred particularly in a convective manner between the workpieces and the temperature-controlled fluid, and at least one temperature measuring element disposed in the process chamber. At least one sensor element that has a defined mass is disposed in the process chamber such that heat is convectively transferred between the sensor element and the fluid. Moreover, an apparatus is provided for cooling and/or heating the sensor element, wherein the temperature of the sensor element can be measured by the temperature measuring element. |
