发明名称 NITRIDE SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a nitride semiconductor substrate which can achieve both a higher threshold voltage and a reduced current collapse and is suitable for a normally-off type high-voltage device; and a method of manufacturing the same. <P>SOLUTION: A nitride semiconductor substrate 10 comprises: a substrate 1; a buffer layer 2 that is formed on one main surface of the substrate 1; an intermediate layer 3 that is formed on the buffer layer 2; an electron transit layer 4 that is formed on the intermediate layer 3; and an electron supply layer 5 that is formed on the electron transit layer 4. In the substrate 10, Al<SB POS="POST">x</SB>Ga<SB POS="POST">1-x</SB>N(0.05&le;x&le;0.24), which has a thickness of at least 200 nm and 1500 nm or less and a carbon concentration of at least 5&times;10<SP POS="POST">16</SP>atoms/cm<SP POS="POST">3</SP>and 1&times;10<SP POS="POST">18</SP>atoms/cm<SP POS="POST">3</SP>or less, is used as the intermediate layer 3; and Al<SB POS="POST">y</SB>Ga<SB POS="POST">1-y</SB>N(0&le;y&le;0.04), which has a thickness of at least 5nm and 200 nm or less, is used as the electron transit layer 4. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013008938(A) 申请公布日期 2013.01.10
申请号 JP20110248155 申请日期 2011.11.14
申请人 COVALENT MATERIALS CORP 发明人 YOSHIDA AKIRA;KOMIYAMA JUN;ABE YOSHIHISA;OISHI KOJI;ERIGUCHI KENICHI;SUZUKI SHUNICHI
分类号 H01L21/338;H01L21/205;H01L29/778;H01L29/812 主分类号 H01L21/338
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