发明名称 |
UNIVERSAL INTER-LAYER INTERCONNECT FOR MULTI-LAYER SEMICONDUCTOR STACKS |
摘要 |
An apparatus, program product and method facilitate the design of a multi-layer circuit arrangement incorporating a universal, standardized inter-layer interconnect in a multi-layer semiconductor stack to facilitate interconnection and communication between functional units disposed on a stack of semiconductor dies. Each circuit layer in the multi-layer semiconductor stack is required to include an inter-layer interface region that is disposed at substantially the same topographic location such that when the semiconductor dies upon which such circuit layers are disposed are arranged together in a stack, electrical conductors disposed within each semiconductor die are aligned with one another to provide an inter-layer bus that is oriented vertically, or transversely, with respect to the individual circuit layers.
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申请公布号 |
US2013009324(A1) |
申请公布日期 |
2013.01.10 |
申请号 |
US201213618600 |
申请日期 |
2012.09.14 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION;BARTLEY GERALD K.;HOOVER RUSSELL DEAN;JOHNSON CHARLES LUTHER;VANDERWIEL STEVEN PAUL;VAREKAMP PATRICK RONALD |
发明人 |
BARTLEY GERALD K.;HOOVER RUSSELL DEAN;JOHNSON CHARLES LUTHER;VANDERWIEL STEVEN PAUL;VAREKAMP PATRICK RONALD |
分类号 |
H01L23/522;G06F17/50;H01L23/48 |
主分类号 |
H01L23/522 |
代理机构 |
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