ETCHING LIQUID FOR COPPER OR COMPOUND HAVING COPPER AS PRIMARY COMPONENT
摘要
The present invention relates to an etching liquid for copper or a compound having copper as a primary component, where the etching liquid is characterized by containing (A) a maleate ion source and (B) a copper ion source, and an etching method that uses this etching liquid.
申请公布号
WO2013005631(A1)
申请公布日期
2013.01.10
申请号
WO2012JP66533
申请日期
2012.06.28
申请人
MITSUBISHI GAS CHEMICAL COMPANY, INC.;TAMAI, SATOSHI;YUBE, KUNIO;OKABE, SATOSHI
