| 摘要 |
The invention relates to a device for the heat treatment of workpieces, in particular printed circuit boards or the like equipped with electrical and electronic components, said device comprising a process chamber (1) in which there is formed or arranged at least one heating or cooling zone which has a heating or cooling device and through which the workpieces are transported along a transporting section with heating or cooling, wherein a pressurized, gaseous fluid can be introduced into the heating or cooling zone via inflow openings (18). |
