Processing substrate, comprises applying material on substrate and/or removing material from substrate, and transferring heat between heating or cooling body and substrate simultaneously and/or at different times, by array of blades

摘要

Processing substrate, comprises applying a material on a substrate (1) and/or removing a material from a substrate, and transferring heat between a heating or a cooling body (2) and the substrate simultaneously and/or at different times. The heat is passed between the heating or the cooling body and the substrate by an array of blades (3), which respectively comprise a retaining element for connecting with the heating or the cooling body, a contact element for thermally conductive contacting of the substrate and a connecting element connecting a holding element and the contact element. Processing substrate, comprises applying a material on a substrate (1) and/or removing a material from a substrate, and transferring heat between a heating or a cooling body (2) and the substrate simultaneously and/or at different times. The heat is passed between the heating or the cooling body and the substrate by an array of blades (3), which respectively comprise a retaining element for connecting with the heating or the cooling body, a contact element for thermally conductive contacting of the substrate and a connecting element connecting a holding element and the contact element. The holding element, connecting element and the contact element are produced integrally. The contact element is held resiliently by the connecting element, which is orthogonal to the substrate surface. An independent claim is also included for a substrate processing device comprising at least one substrate processing device for loading or removing material and the heating- or cooling body for heat transfer from or to the substrate, where the blades are arranged on the surface of the heating- or cooling body, where each blade comprises the retaining element for connection with the heating- or cooling body, the contact element for contacting the heat conducting substrate and the retaining element, and the contact element for joining connecting element. The holding element, connecting element and the contact element are manufactured in one piece and the contact element is held resiliently by the connecting element, which is orthogonal to the substrate surface.