发明名称 KNEADING APPARATUS AND METHOD FOR PRODUCING SEMICONDUCTOR ENCAPSULATING RESIN COMPOSITION
摘要 The kneading apparatus 1 includes a casing 2, a pair of elongated screws 4a, 4b rotatably provided in the casing 2. The screws 4a, 4b are arranged parallel and horizontally with respect to one another. The casing 2 has a main body 20 and a screw container 3 provided in the casing 2. The screw container 3 defines a kneading section 30 therein. The screw 4a includes a screw axis 41 having an outer periphery, a first screw member 42 provided on the outer periphery of the screw axis 41 and a kneading member 43 provided on the outer periphery of the screw axis 41. The first screw member 42 and kneading member 43 are provided in the kneading section 30. The screw 4a, the first screw member 42 and the kneading member 43 respectively have core portions 411, 412, 413 having a surface and outer layers 45 respectively provided on the surfaces of the core portions 411, 412, 413. The screw container 3 and the outer layers 45 are constituted of a nonmetallic material.
申请公布号 US2013010566(A1) 申请公布日期 2013.01.10
申请号 US201113636881 申请日期 2011.03.02
申请人 SUMITOMO BAKELITE COMPANY LIMITED;UEDA SHIGEHISA;NODA KAZUO 发明人 UEDA SHIGEHISA;NODA KAZUO
分类号 B29B7/80 主分类号 B29B7/80
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