发明名称 |
SEMICONDUCTOR DEVICE PACKAGE HAVING CONFIGURABLE LEAD FRAME FINGERS |
摘要 |
Embodiments of the present invention relate to the use of configurable lead frame fingers in a semiconductor device package. More specifically, the lead frame of a device package can include a plurality of fingers used to support and provide electrical contact to the die. The die can include a plurality of contacts that comprise a series of parallel columns located a certain distance from one another, and the fingers of the lead frame can be configured to align with the contacts. The lead frame can have multiple terminals, each with one or more fingers and pins. As such, each lead frame configuration may be utilized with different configurations of die. |
申请公布号 |
US2013009297(A1) |
申请公布日期 |
2013.01.10 |
申请号 |
US201213348322 |
申请日期 |
2012.01.11 |
申请人 |
GEM SERVICES, INC.;TSUI ANTHONY C.;YANG HONGBO;ZHOU MING;CHU WEIBING;CHIA ANTHONY |
发明人 |
TSUI ANTHONY C.;YANG HONGBO;ZHOU MING;CHU WEIBING;CHIA ANTHONY |
分类号 |
H01L23/495;H01L21/56 |
主分类号 |
H01L23/495 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|