发明名称
摘要 PROBLEM TO BE SOLVED: To reduce the manufacturing cost of a wiring board by making efficient a process of forming a wiring pattern and forming the wiring pattern with high precision. SOLUTION: A method of manufacturing the wiring board in which when a wiring layer or an insulating layer is formed in a predetermined pattern, the resist pattern is formed by coating the surface of a workpiece with resist, exposing the resist to the predetermined pattern, and developing the resist employs a method of exposure using a glass mask and a method of drawing exposure using a laser beam in combination as the process of exposing the resist 15. COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP5114308(B2) 申请公布日期 2013.01.09
申请号 JP20080157528 申请日期 2008.06.17
申请人 发明人
分类号 H05K3/00;H05K3/06;H05K3/18;H05K3/46 主分类号 H05K3/00
代理机构 代理人
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