| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation structure which can reduce thermal resistance from a heating element to a heat sink although the heat dissipation structurebeing is attached with a small pressing force. SOLUTION: A heat dissipation structure 10 which is mounted on a heating element H and dissipates heat of the heating element H, includes a heat sink 12; a heat transfer sheet 11 made from expanded graphite, which heat transfer sheet is arranged between the heat sink 12 and the heating element H; and a resin film 13 arranged at least either between the heat transfer sheet 11 and the heating H or between the heat transfer sheet 11 and the heat sink 12. The heat transfer sheet 11 made from expanded graphite is adopted, which can reduce thermal resistance from the heating element H to the heat sink 12, thereby improving effect of cooling the heating element H. In addition, the resin film 13 can prevents, for example, expanded graphite leaving the heat transfer sheet 11 from dispersing around the heat transfer sheet 11. COPYRIGHT: (C)2008,JPO&INPIT |
