| 摘要 |
<p>The system has insulating bodies spaced from each other and material- or operatively arranged on a cooling device (14) with a main surface. A strip conductor partially covers another main surface of the bodies, and an intermediate space between the bodies with a connection section. Multiple power semiconductor components e.g. power transistors (102, 104, 122, 124) and power diodes (106, 108, 126, 128), are arranged in an alignment to one of the associated bodies. An internal link assembly is designed as wire or tape connection and as a flexible circuit board with another strip conductor. The insulating bodies are made of ceramic material. An independent claim is also included for a manufacturing method for a power electronic system.</p> |
